COMSOL 6.4 - Physics Interfaces for Modeling Heat Transfer in Solids

Table 2-2 gives a summary of the thermal physics interfaces showing which physics nodes are available in each interface.

Table 2-2: Summary of the Physics Interfaces for modeling heat transfer and Thermal Expansion in the MEMS module.
Physics Interface	ID	Heat Transfer Included	Solid Mechanics Included?	Electric Currents and Joule Heating Included?	Modeling Thermal Stresses
Heat Transfer in Solids	ht	Yes	No	No	Not applicable — would need to add Solid Mechanics separately.
Solid Mechanics	solid	No	Yes	No	Add Thermal Expansion node & specify Tref and T.
Thermal Stress	—	Yes	Yes	No	Specify Tref in the Thermal Expansion node under Multiphysics.
Joule Heating	—	Yes	No	Yes	Not applicable — would need to add Solid Mechanics separately.
Joule Heating and Thermal Expansion	—	Yes	Yes	Yes	Specify Tref in the Thermal Expansion node under Multiphysics.