Piezoresistivity
The piezoresistive effect describes the change in a material’s conductivity when a stress is applied to the material. Unlike the piezoelectric effect, piezoresistivity is not reversible, so an applied current does not induce a stress (unless other secondary effects are present, such as heating). Piezoresistance is usually associated with semiconductor materials. In semiconductors, piezoresistance results from the strain-induced alteration of the material’s band structure and the associated changes in carrier mobility and number density.
Piezoresistivity can be described in terms of a stress-induced change in the resistivity of the material. The relation between the electric field, E, and the current, J, becomes:
where ρ is the resistivity and Δρ is the induced change in the resistivity. In the general case, ρ and Δρ are both rank-2 tensors (matrices). The change in resistance is related to the stress, σ, (for the piezoresistance form of the equations) or the strain, ε, (for the elastoresistance form of the equations) by the constitutive relationship:
(2-13)
where Π is the piezoresistance tensor (SI unit: Pa1Ω⋅m) and M is the elastoresistance tensor (SI unit: Ω⋅m). Note that both of these quantities are material properties. Π and M are in this case rank-4 tensors; however, they can be represented as matrices if the resistivity, stress, and strain are converted to vectors within a reduced subscript notation.
In practice, piezoresistors are fabricated by doping a thin layer of a lightly doped wafer, either using the process of ion implantation or by diffusing dopant into the wafer from its surface at high temperatures. Both processes usually produce thin piezoresistors, typically 100s of nm thick in structures that are microns or tens of microns thick. These aspect ratios are challenging to resolve with a practical mesh, so the MEMS Module includes physics interfaces that make it possible to model the current conduction in a thin layer, represented by a boundary in the model geometry. The Piezoresistivity, Boundary Currents interface is appropriate for situations in which the thickness of the piezoresistive layer is much less than that of the structural layer. If the structural layer is also sufficiently thin that it can be represented using the Shell interface, then the Piezoresistivity, Shell interface can be used (requires the Structural Mechanics Module in addition to the MEMS Module). This circumstance is frequently encountered in modeling pressure sensors, which usually have piezoresistors embedded near the edge of large membranes. Note that the Piezoresistive Layer is still assumed to be much thinner than the structural layer in this physics interface. Finally if both the conducting and structural layers are meshed through their thicknesses the Piezoresistivity, Domain Currents interface can be used. This physics interface allows for advanced modeling of, for example, nonuniform doping profiles in the piezoresistor at the expense of additional degrees of freedom in the model.