About the MEMS Module
The MEMS Module is a collection of physics interfaces for the simulation of MEMS devices. It has a range of tools to address the specific challenges of modeling microsystems. It includes physics interfaces to model electromechanics (used for modeling electrostatically actuated structures), solid mechanics, piezoelectricity, piezoresistivity, and electrical circuits (which can be straightforwardly coupled to domain models). There are several predefined interfaces to model thermal-structural interactions, including the Thermoelasticity interface (for modeling damping in high quality factor resonators), Joule Heating with Thermal Expansion (for modeling thermal actuators), and the Thermal Stress interface (used for modeling thermal stresses when thermal gradients are present within devices). The Fluid-Structure Interaction interface implements a fully bidirectional coupling between fluid flow and structural motion, including the viscous, pressure, and inertial fluid forces as well as momentum transfer from the solid to the fluid. Finally the Thin-Film Flow interfaces allow thin layers of fluid to be modeled in an efficient manner and can be straightforwardly coupled to structural displacement to model damping phenomena, even under rarefied conditions.
COMSOL Multiphysics is uniquely transparent because the model equations are always visible and you have complete freedom in the definition of phenomena that are not predefined in the module.
The MEMS Module Application Library and supporting documentation explain how to use the physics interfaces to model a range of MEMS devices.
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Coupling to Other Physics Interfaces
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Physics and Scaling for MEMS Devices
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The MEMS Module Study Capabilities by Physics Interface
