How the Heat Transfer Module Improves Your Modeling
The Heat Transfer Module has been developed to greatly expand upon the base capabilities available in COMSOL Multiphysics. The module supports all fundamental mechanisms including conductive, convective, and radiative heat transfer. Using the physics interfaces in this module along with the inherent multiphysics capabilities of COMSOL Multiphysics, you can model a temperature field in parallel with other physics — a versatile combination increasing the accuracy and predicting power of your models.
This book introduces the basic modeling process. The different physics interfaces are described and the modeling strategy for various cases is discussed. These sections cover different combinations of conductive, convective, and radiative heat transfer. This guide also reviews special modeling techniques for thin layers, thin shells, participating media, and out-of-plane heat transfer. Throughout the guide the topics and examples increase in complexity by combining several heat transfer mechanisms and also by coupling these to physics interfaces describing fluid flow — conjugate heat transfer.
Another source of information is the Heat Transfer Module Application Library, a set of fully documented examples that is divided into broadly defined application areas where heat transfer plays an important role — electronics and power systems, processing and manufacturing, and medical technology — and includes tutorial and verification models.
Most of the examples involve multiple heat transfer mechanisms and are often coupled to other physical phenomena, for example, fluid dynamics, moisture transport, or electromagnetics. The authors developed several state-of-the art examples by reproducing examples that have appeared in international scientific journals. See
Where Do I Access the Documentation and Application Libraries?
.