COMSOL 6.4 - Heat Transfer in Solids (ht)

Heat Transfer in Solids (ht)

Now update the model to evaluate the effect of the thermal contact between the chip and the heat sink. First assume a poor thermal contact due to a thin film of air between the chip and the heat sink.

Thermal Contact1

1

In the Physics toolbar, click Boundaries

and choose Thermal Contact

2

Select the interface between the electronics packaging and the heat sink, boundary 15. Verify that it appears in the Settings window for Thermal Contact in the Boundary Selection section.

To facilitate the selection of this boundary in the following steps, create a dedicated selection for it.

3

Locate the Selection section; click Create Selection

; and, in the dialog, type Chip/Heat Sink Interface in the text field.

4

5

Locate the Thermal Contact section and from the Contact model list, choose Equivalent thin resistive layer.

6

In the Specify list, select Layer thermal conductivity and thickness.

7

Keep the default value, From material, for the Layer thermal conductivity and in the ds text field, enter 50[um].