The Curing Reaction interface now includes a Solid node for modeling curing processes in solid domains. The Curing Reaction Heating multiphysics coupling has been extended to couple the Heat Transfer in Solids interface with the Curing Reaction interface in solids. In addition, the Curing Kinetics node has been renamed to Fluid for clarity.

An error in the implementation of the Ternary Phase Field interface’s Wetted Wall feature, which resulted in the wrong contact angle between the phases A and B when the three surface-tension coefficients were not identical, has been corrected. As a result, the definitions of the contact angles now agree with the figure shown in the feature’s Settings window.