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A force balance for the structural analysis with a volume load caused by thermal expansions. The device is fixed at the positions where it is attached to a circuit board (see Figure 1). The effect of possible thermal expansion for the circuit board is investigated.
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In the Select Physics tree, select Structural Mechanics > Thermal–Structure Interaction > Thermal Stress, Solid.
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Click Add.
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Click in the Graphics window and then press Ctrl+A to select all objects.
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Select the object r3 only.
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In the Model Builder window, under Component 1 (comp1) > Geometry 1 right-click Work Plane 1 (wp1) and choose Extrude.
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Go to the Add Material window.
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Click the Add to Component button in the window toolbar.
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Find the Expression for remaining selection subsection. In the Volume reference temperature text field, type 298[K].
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In the Model Builder window, expand the Results > Stress (solid) > Volume 1 node, then click Deformation.
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Select the Manual color legend settings checkbox.
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Go to the Add Material window.
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Right-click and choose Add to Component 1 (comp1).
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In the Model Builder window, under Component 1 (comp1) > Definitions > Shared Properties click Model Input 1.
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In the text field, type 298[K].
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In the Model Builder window, under Component 1 (comp1) > Solid Mechanics (solid) > Fixed Constraint 1 click Thermal Expansion 1.
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In the Model Builder window, under Component 1 (comp1) > Definitions > Shared Properties click Model Input 2.
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In the text field, type solid.T.
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Go to the Add Study window.
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Click the Add Study button in the window toolbar.
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In the Model Builder window, under Results, Ctrl-click to select Stress (solid) and Temperature (ht).
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Right-click and choose Group.
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Clear the Color checkbox.
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Clear the Color and data range checkbox.
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Select the Modify model configuration for study step checkbox.
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In the tree, select Component 1 (comp1) > Solid Mechanics (solid) > Fixed Constraint 1 > Thermal Expansion 1.
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