The Solid–Thin-Film Damping (
) interface can be used to model phenomena where a thin-film fluid and a deformable solid affect each other. The fluid can be either a liquid or a gas, with the possibility to include cavitation in liquids.
Use the Solid–Thin-Film Damping interface to apply boundary loads to the surface of a resonator that result from squeeze-film or slide-film damping. Examples of common situations in which these types of damping are appropriate are parallel-plate capacitive and comb-drive actuators for squeeze-film and slide-film damping, respectively.
You add a predefined Solid–Thin-Film Damping interface from the
Fluid–Structure Interaction (
) group in the
Structural Mechanics branch (
) of the
Model Wizard or
Add Physics windows.
Solid Mechanics and
Thin-Film Flow interfaces are then added to the Model Builder.
In addition, the Multiphysics node is added, which automatically includes the multiphysics coupling feature
Structure Thin-Film Flow Interaction.
For example, if Thin-Film Flow and Solid Mechanics interfaces are added, COMSOL Multiphysics adds an empty Multiphysics node. You can choose from the available coupling features, but the modified settings are not included.
The Structure–Thin-Film Flow Interaction coupling feature is used to couple the interfaces.
Physics nodes are available from the Physics ribbon toolbar (Windows users),
Physics context menu (macOS or Linux users), or right-click to access the context menu (all users).