The opposite effect, where changes in stress cause heat generation, may be important in small structures vibrating at high frequencies. The Thermoelasticity interface, available with the MEMS Module, is designed for analyzing such problems.

It is also possible to take this effect into account by adding the Thermoelastic Damping node to the Heat Transfer in Solids interface. When you add a Thermal Expansion node to a material in the Solid Mechanics interface, the heat source term is computed and made available to the Heat Transfer in Solids interface.

When you add a Thermal Expansion node under the Multiphysics Couplings branch, it is possible to select whether the thermoelastic damping effect should be taken into account or not. The heat source contribution is then included automatically without adding any data in the heat transfer interface.

In either case, the heat source term is only present when Structural Transient Behavior is set to Include inertial terms.