The Piezoelectricity and Pyroelectricity interface (
) combines Solid Mechanics, Electrostatics, and Heat Transfer in Solids together with the constitutive relationships required to model piezoelectric applications, in which the temperature variation and electric charge are coupled. It requires the MEMS Module license.
The Piezoelectricity and Pyroelectricity interface is available for 3D, planar 2D, and axisymmetric 2D geometries.
When this multiphysics interface is added using the Model Wizard, a
Solid Mechanics interface, an
Electrostatics interface, and a
Heat Transfer in Solids interface are added to the
Model Builder.
In addition, the Multiphysics Couplings node is added, which automatically includes three multiphysics coupling nodes:
Piezoelectricity,
Pyroelectricity, and
Thermal Expansion.
The participating Solid Mechanics interface includes the default
Piezoelectric Material feature with its selection set to all domains. The
Electrostatics interface has a default
Charge Conservation, Piezoelectric feature with similar settings. Such features can be also added manually to their corresponding interfaces similar to any other material model therein. The
Piezoelectricity multiphysics coupling node can be active only on the selection, where both features Piezoelectric Material and Charge Conservation, Piezoelectric are active. You specify the piezoelectric coupling data together with both the structural and electrical material data under the Piezoelectric Material node.
The Heat Transfer in Solids will use its default domain feature,
Solid, where you enter the thermal properties of the material. All heat transfer functionality for modeling is also accessible to include surrounding elastic solids or air domains. To model heat transfer by convection in nonsolid domains, you can add a
Fluid feature. Remove all domains selected under such feature from the entire Solid Mechanics interfaces selection.
You enter the pyroelectric coupling data on the Pyroelectricity multiphysics coupling node, and the thermal expansion data on the
Thermal Expansion multiphysics coupling node.