). The branch includes multiphysics interfaces that combine electromagnetics with heat transfer or heat transfer and structural mechanics. The multiphysics interfaces for electromagnetic heating are described in the subsequent sections:). The branch includes multiphysics interfaces that combine electromagnetics with heat transfer or heat transfer and structural mechanics. The multiphysics interfaces for electromagnetic heating are described in the subsequent sections:|
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The Joule Heating Interface (
 ): It combines all features from the Electric Currents interface with the Heat Transfer interface to model resistive heating and heating due to dielectric losses. The predefined multiphysics couplings add the electromagnetic power dissipation as a heat source, and the electromagnetic material properties can depend on the temperature. |
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The Joule Heating and Thermal Expansion Interface (
 ): It combines thermal, electric, and structural multiphysics effects. The predefined interaction adds the electromagnetic losses from the electric current as a heat source. In addition, the temperature from the Heat Transfer in Solids interface acts as a thermal load for the Solid Mechanics interface, causing thermal expansion. It requires either the Structural Mechanics Module or the MEMS Module license. |
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The Induction Heating Interface (
 ): It combines all features from the Magnetic Fields interface in the time-harmonic formulation with the Heat Transfer interface to model induction and eddy current heating. The predefined multiphysics couplings add the electromagnetic power dissipation as a heat source, and the electromagnetic material properties can depend on the temperature. This physics interface is based on the assumption that the magnetic cycle time is short compared to the thermal time scale (adiabatic assumption). |
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The Pyroelectricity Interface (
 ): It combines Heat Transfer in Solids and Electrostatics interfaces together with the constitutive relationships required to model pyroelectricity. Both the direct pyroelectric and inverse electrocaloric effects can be modeled. It requires the MEMS Module license. |