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A force balance for the structural analysis with a volume load caused by thermal expansions. The device is fixed at the positions where it is attached to a circuit board (see Figure 1). The effect of possible thermal expansion for the circuit board is investigated.
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In the Select Physics tree, select Structural Mechanics>Thermal-Structure Interaction>Thermal Stress, Solid.
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Click Add.
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Click Study.
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Click Done.
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Select the object c2 only.
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Click in the Graphics window and then press Ctrl+A to select all objects.
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Select the object r3 only.
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In the Model Builder window, under Component 1 (comp1)>Geometry 1 right-click Work Plane 1 (wp1) and choose Extrude.
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Click OK.
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In the Model Builder window, under Component 1 (comp1)>Multiphysics click Thermal Expansion 1 (te1).
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Find the Expression for remaining selection subsection. In the Volume reference temperature text field, type 298[K].
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In the Model Builder window, under Component 1 (comp1) right-click Solid Mechanics (solid) and choose Fixed Constraint.
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In the Model Builder window, expand the Results>Stress (solid)>Volume 1 node, then click Deformation.
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In the Model Builder window, under Component 1 (comp1)>Definitions>Shared Properties click Model Input 1.
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In the text field, type 298[K].
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In the Model Builder window, under Component 1 (comp1)>Solid Mechanics (solid)>Fixed Constraint 1 click Thermal Expansion 1.
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In the Model Builder window, under Component 1 (comp1)>Definitions>Shared Properties click Model Input 2.
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In the text field, type solid.T.
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In the Model Builder window, under Results, Ctrl-click to select Stress (solid), Temperature (ht), and Isothermal Contours (ht).
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Right-click and choose Group.
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Clear the Color check box.
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In the Model Builder window, under Results>Stress Comparison, Ctrl-click to select Volume 1 and Line 1.
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Right-click and choose Duplicate.
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Click Plot.
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In the tree, select Component 1 (comp1)>Solid Mechanics (solid)>Fixed Constraint 1>Thermal Expansion 1.
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Click Disable.
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