•
|
Thermal conductivity ki. The default uses the material values for phase i. For User defined select Isotropic, Diagonal, Symmetric, or Anisotropic based on the characteristics of the thermal conductivity, and enter another value or expression. The default is 1 W/(m·K).
|
•
|
•
|
Thermal conductivity ki. The default uses the material values for phase i. For User defined select Isotropic, Diagonal, Symmetric, or Anisotropic based on the characteristics of the thermal conductivity, and enter another value or expression. The default is 1 W/(m·K).
|
•
|
•
|
•
|
It is useful to choose three or more phase transitions to handle extra changes of material properties such as in mixtures of compounds, metal alloys, composite materials, or allotropic varieties of a substance. For example, α, γ, and δ-iron are allotropes of solid iron that can be considered as phases with distinct phase change temperatures.
|
When Surface-to-surface radiation is activated, the Opacity (Surface-to-Surface Radiation interface) subnode is automatically added to the entire selection, with Transparent option selected. The domain selection can’t be edited. To set some part of the domain as opaque, add a new Opacity (Surface-to-Surface Radiation interface) subnode from the context menu (right-click the parent node) or from the Physics toolbar, Attributes menu.
|
To satisfy energy and mass conservation in phase change models, particular attention should be paid to the density in time simulations. When the material density is not constant over time — for example, dependent on the temperature — volume change is expected. The transport velocity field and the density must be defined so that mass is conserved locally. A The Moving Mesh Interface (described in the COMSOL Multiphysics Reference Manual) can be used to account for model deformation.
|
Phase Change: Application Library path Heat_Transfer_Module/Phase_Change/phase_change
Continuous Casting: Application Library path Heat_Transfer_Module/Thermal_Processing/continuous_casting
Cooling and Solidification of Metal: Application Library path Heat_Transfer_Module/Thermal_Processing/cooling_solidification_metal
|