Thermal Expansion (for materials)
Use the Thermal Expansion subnode to add an internal thermal strain caused by changes in temperature.
The Thermal Expansion subnode is only available with some COMSOL products (see http://www.comsol.com/products/specifications/).
Model Inputs
From the Temperature T list, select an existing temperature variable from a heat transfer interface (for example, Temperature (ht)), if any temperature variables exist, or select User defined to enter a value or expression for the temperature.
Thermal Expansion Properties
Select an Input type to select how the thermal strain is specified. The default is Secant coefficient of thermal expansion, in which case the thermal strain is given by
where α is the secant coefficient of thermal expansion. α can be temperature dependent.
When Input type is Tangent coefficient of thermal expansion, the thermal strain is given by
where αt is the tangential coefficient of thermal expansion.
When Input type is Thermal strain, enter the thermal strain dL as function of temperature explicitly.
In all three cases, the default is to take values From material. When entering data as User defined, select Isotropic, Diagonal or Symmetric to enter one or more components for a general coefficient of the thermal expansion tensor or the thermal strain tensor. When a non-isotropic input is used, the axis orientations are given by the coordinate system selection in the parent node.
Enter a value or expression for the Strain reference temperature Tref which is the reference temperature that defines the change in temperature together with the actual temperature.
A heat source term will be created by this node. It can be accessed from a Thermoelastic Damping node in a heat transfer interface in order to incorporate the reversed effect that heat is produced by changes in stress. The heat source term is only present when Structural Transient Behavior is set to Include inertial terms.
Thermal Stresses in a Layered Plate: Application Library path Structural_Mechanics_Module/Thermal-Structure_Interaction/layered_plate
MEMS_Module/Actuators/layered_plate
Location in User Interface
Context Menus
Solid Mechanics>Linear Elastic Material>Thermal Expansion
Solid Mechanics>Nonlinear Elastic Material>Thermal Expansion
Solid Mechanics>Hyperelastic Material>Thermal Expansion
Solid Mechanics>Piezoelectric Material>Thermal Expansion
Solid Mechanics>Cam-Clay Material>Thermal Expansion
Membrane>Linear Elastic Material>Thermal Expansion
Membrane>Nonlinear Elastic Material>Thermal Expansion
Membrane>Hyperelastic Material>Thermal Expansion
Multibody Dynamics>Linear Elastic Material>Thermal Expansion
Ribbon
Physics tab with Linear Elastic Material, Hyperelastic Material, Nonlinear Elastic Material, Piezoelectric Material, or Cam-Clay Material node selected in the model tree:
Attributes>Thermal Expansion