The Temperature Coupling feature is generic and specifies a Heat Transfer interface as Source and a second interface as Destination. When Temperature Coupling feature is used, the temperature from the Source is used to evaluate material properties in any feature from the Destination interface. The coupling can be added wherever the Heat Transfer interface is active.

The Source interface can be any interface defining a temperature, which includes all versions of heat transfer and multiphysics, except the pure radiation interfaces.

The Destination interface can be any interface providing multiphysics feature in the Multiphysics node — for example, Electric Current or Solid Mechanics.

See Temperature Coupling in the COMSOL Multiphysics Reference Manual for more details about this multiphysics coupling.